Development Report
- MultiProbe Supports Scientific Advancements as Moore’s Law Gains Momentum
- Today's electronic companies are challenging the tenets of Moore's Law, developing ever-shrinking semiconductors at an accelerated pace. However, in order for technology to advance,
research tool manufacturers need to not only keep up, but also take initiative by developing instruments for new generations of technology to come. MultiProbe leads the way in microscopy development
by remaining responsive to, and proactive in, the evolution of electronics and its industry.
In fact, MultiProbe got its start by responding to obstacles in failure analysis techniques. Analyzing infinitesimal circuit sizes with charge beam tools, such as the SEM and FIB, skew results by dramatically shifting the electrical characteristics of thin gate devices and producing inaccurate electrical measurements. MultiProbe entered the scene with an Atomic Force Probe that provides accurate electrical measurements by way of a noninvasive, nondestructive technique for locating the root cause of any Semiconductor device failure.
More recently, MultiProbe has introduced the MP2 head that extends its AFP platform capabilities to include up to six heads, and has demonstrated successful 32nm SRAM and logic probing. In addition is the new Scanning Capacitance (SCM) imaging mode that allows analysts to localize structures embedded in silicon oxide thin films. This mode works simultaneously with standard topography and current imaging (PicoCurrent) modes. Finally, MultiProbe™ has recently released a new thermal chuck for high-temperature measurements of products that are exposed to environmentally stressed conditions.
Responding to the needs of the electronics industry, MultiProbe has helped companies progress to the next technology node by providing the means to produce accurate electrical test results. And as these companies strive for faster, more powerful devices, MultiProbe is anticipating the 22nm node and expanding the power and breadth of its tools to be ready when they get there.
Advancements include successfully demonstrated 32nm SRAM and logic probing
